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Soaps, Waxes, Pastes
 

Low Viscosity, High Softening Point, Good Hardness Polyethylene/ Pe Wax


1. Non-toxic and non-irritating, high whiteness and high hardness2. High molecular weight, without low polymer, low thermal weight loss and good thermal stability3. With excellent lubrication and dispersibility, it can improve the brightness and enhance the processing performance
0 (#0) 589 2019.04.10 Low Viscosity, High Softening Point, Good Hardness  Polyethylene/ Pe Wax
Adhesives and Sealants
 

KB 1613 HT


Kohesi Bond KB 1613 HT is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. KB 1613
0 (#0) 260 2017.05.22 KB 1613 HT
Adhesives and Sealants
 

KB 1613 RLV


Kohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. KB 161
0 (#0) 213 2017.05.22 KB 1613 RLV
Adhesives and Sealants
 

TUF 1613 HT-CM


Kohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatur
0 (#0) 219 2017.05.22 TUF 1613 HT-CM
Adhesives and Sealants
 

TUF 1613 HT-DA


Kohesi Bond TUF 1613 HT-DA is a fast curing, true single component epoxy system for die attach applications. Unlike other die attach systems, TUF 1613 HT-DA is not a premixed and frozen system. It only needs elementary refrigeration for storage and offers an unlimited working life at room tempera
0 (#0) 278 2017.05.22 TUF 1613 HT-DA
Adhesives and Sealants
 

TUF 1613 HT-GT


Kohesi Bond TUF 1613 HT-GT is a single component, toughened epoxy system that requires no mixing and cures rapidly at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated te
0 (#0) 301 2017.05.22 TUF 1613 HT-GT
Adhesives and Sealants
 

TUF 1613 HT-SM


Kohesi Bond TUF 1613 HT-SM is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures. TUF 1
0 (#0) 251 2017.05.22 TUF 1613 HT-SM
Adhesives and Sealants
 

TUF 1820 ANHT


Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 90 min
0 (#0) 278 2017.05.22 TUF 1820 ANHT
Adhesives and Sealants
 

TUF 1820 AOHT


Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes at 120°C and even faster at higher temperatures. TUF 1820 AOHT offers a sweeping servic
0 (#0) 242 2017.05.22 TUF 1820 AOHT
Adhesives and Sealants
 

TUF 1828 TC


Kohesi Bond TUF 1828 TC is a toughened, single component, thermal management epoxy system that offers an unlimited working life at room temperature. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as th
0 (#0) 219 2017.05.22 TUF 1828 TC
Adhesives and Sealants
 

KB-SS-SCN


Kohesi Bond KB-SS-SCN is a silver coated nickel filled, sodium silicate based coating system. Firstly, this product offers very good electrical conductivity. This products offers very high levels of shielding towards electromagnetic interference (EMI) and radio frequency interference (RFI), along
0 (#0) 306 2017.05.22 KB-SS-SCN
Adhesives and Sealants
 

KB-SS-SIL


Kohesi Bond KB-SS-SIL is a silver filled, sodium silicate based coating system. Firstly, this product offers phenomenal electrical conductivity. This products offers the highest level of shielding towards electromagnetic interference (EMI) and radio frequency interference (RFI). Shielding effecti
0 (#0) 279 2017.05.22 KB-SS-SIL
Adhesives and Sealants
 

KB 1427 HT


Kohesi Bond KB 1427 HT is a marvelous single component epoxy system for bonding, coating, sealing and casting applications. Although it requires a minimum temperature of 150°C for curing, it can achieve faster cures at elevated temperatures. KB 1427 HT offers an extremely wide serviceable tem
0 (#0) 281 2017.05.20 KB 1427 HT
Adhesives and Sealants
 

KB 1427 HT-3


Kohesi Bond KB 1427 HT-3 is an exclusive one component epoxy system that can cure completely in 2 – 3 minutes at 150°C. Although it requires a minimum temperature of 120°C for curing, it cures equally fast (3 – 5 minutes) at that temperature. KB 1427 HT-3 offers an extremely w
0 (#0) 306 2017.05.20 KB 1427 HT-3
Execution time:0.30128002166748