1.base material analysis:
considering finished product flexility use thin material(18/25um)
considering costs use electrodeposited copper foil
2. flexible board thickness:0.2mm
3. surface finished :immersion gold
4. lay up analysis instruction:
PI film+polyimide+base material(copper foil+polyimide+PI film+polyimide+copper foil) +polyimide+PI film
5. lay out: three group loop,fix one dot digit as terra
6. outline:punching die
7. metal dome assembly:
punching die production metal dome and fix up thermosetting polyimide,SMT debugging.
If you feel interest, please feel free to contact:
Contact:
Market manager: Shizheng Jiang; English name: Justin
Mobile phone: 13926504899
Tel: -86-0755-27698323
MSN: [This information will show after login with premium membership]
QQ: 223504899
Skype: sunshinepcba
E-mail: [This information will show after login with premium membership]
Website: Http://[This information will show after login with premium membership]
http://www.google.com/reader/shared/13807397211511974133?hl=en
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