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Tape for Semiconductor in processing the wafer
AP series & AU series
UV tape & non-UV tape
Usage : Backgrinding, Dicing(sawing), Packaging
Width : 150 - 350mm (variable)
Length : 100m (variable)
Payment term : L/C or T/T
Delivery : within 30days after P/O
Packing : 4rolls/carton
Minimum order : 40rolls
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