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Product Description :
- The picture on the left side is that of just produced body parts of semiconductors that are widely used in computer and other appliances. Generally, the products are divided into for-transistor, IC and LOC, and the current market is in transition to high- performance and small-size LOC, thus LOC is being more emphasized. This L/F undergoes A/E attach, wire bonding, trimming, forming, molding and final testing.
- The picture on the right side is that of a die press. Among high-precision characteristics, die-related parts are assembled and controlled up to the accuracy of 1~2 , and since the production trend of L/F is now small-in-size, more accurate and sophistica ted technology is required. Generally, 50~100 tone of weight is used for pressing, and all the die-pressed products must undergo plating,
taping, down set and out off.
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| Posted by |
trade international
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| e-Mail | Contact company |
| Address | Palyong-Dong, Charyong Danji 2-29-6,, Changwon, Kyongnam #59 | Country
| Korea 
| Phone
| For registered Members only.
| Fax
| For registered Members only.
| | Key Customers / Clientele | Palyong-Dong, Charyong Danji 2-29-6,, Changwon, Kyongnam | | Company Profile |
Hanbit Precision Industrial Co., Ltd.
| | URL | For registered Members only. | | Rating |  (0 reviews) | | Popular tags | | |
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 | | Keywords (seperated by comma) | Soo-chul | | Product Specifications |
Product Description :
- The picture on the left side is that of just produced body parts of semiconductors that are widely used in computer and other appliances. Generally, the products are divided into for-transistor, IC and LOC, and the current market is in transition to high- performance and small-size LOC, thus LOC is being more emphasized. This L/F undergoes A/E attach, wire bonding, trimming, forming, molding and final testing.
- The picture on the right side is that of a die press. Among high-precision characteristics, die-related parts are assembled and controlled up to the accuracy of 1~2 , and since the production trend of L/F is now small-in-size, more accurate and sophistica ted technology is required. Generally, 50~100 tone of weight is used for pressing, and all the die-pressed products must undergo plating,
taping, down set and out off.
| | Industry Category | | | Quality/Safety Certifications | | | Delivery Lead Time | | | Payment & Price Terms | | | My Offers | | | Product Portfolio / Other Products | | | Customers | | | Detailed Company Introduction | | | FOB Price & Port | | | Packaging Details | | | Our Team | | | Web Site | For registered Members only. |
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| Product Details |
| Product id |
164901 |
| Visits |
147 |
| Date |
2006.05.20 |
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